Call for Papers

2023 Industry Conference & 22nd Annual Meeting 

Presentation on October 18, 2023 at the 
Le Méridien Ra Beach
El Vendrell, Spain

Abstract submission deadline: 
June 2, 2023 

ODVA’s Industry Conference is committed to bringing together the best minds in the industry to present insights on emerging technology, standards, and techniques that will drive the future of industrial automation and smart manufacturing initiatives around the world.  Experts are invited to submit abstracts for consideration on the following topics:

Standards and Technologies

• Functional enhancements to EtherNet/IP™
• Advancements in wireless technologies including 5G
• Advancements in Single Pair Ethernet
• Device information and system integration
• Cybersecurity ecosystem including advancements in CIP Security™
• Time Sensitive Networking
• Cloud connectivity
• Energy usage including carbon neutral
• Virtualization and simulation

Techniques and Best Practices

• Considerations for the selection, integration, and usage of EtherNet/IP and CIP technologies
• Success stories to showcase the application of EtherNet/IP and CIP technologies

Other topics not listed above will be considered provided they are relevant in the context of current and emerging ODVA technology and standards.  The focus of a paper may be targeted at use cases, technical innovations, methods, current and emerging standards, or some combination of these aspects. Papers are expected to examine and propose engineering techniques and innovations to achieve a specific objective.

Paper may be authored by single or multiple individuals who are one of the following demographics:

• Employees, officers, or directors of Member companies
• End users or machine builders who use or have used ODVA technologies in their facilities

At least one author is required to attend ODVA’s 2023 Industry Conference & 22^nd Annual Meeting of Members in person to present the paper.  Following the event, papers will be published online at www.odva.org as a part of the 2023 Industry Conference proceedings. Abstracts can be submitted via the form below by the deadlines listed below.