CompoNet® enables users to maximize network throughput for applications needing to transmit small packets of data quickly between controllers, sensors and actuators. Its simple network connector and cabling scheme reduces overall system cost and time. 

Like all CIP Networks, CompoNet utilizes the Common Industrial Protocol (CIP™) for its upper layers. CIP Networks follow the Open Systems Interconnection (OSI) model, which defines a framework for implementing network protocols in seven layers: physical, data link, network, transport, session, presentation and application. Networks that follow this model define a complete suite of network functionality from the physical implementation through the application or user interface layer.  

CompoNet Technology Overview Series
Read the CompoNet Technology Overview Series: CIP on TDMA Technology (PUB 161)

CIP encompasses a comprehensive suite of messages and services for a variety of manufacturing automation applications, including control, safety, energy, synchronization & motion, information and network management. As a truly media-independent protocol that is supported by hundreds of vendors around the world, CIP provides users with a unified communication architecture throughout the manufacturing enterprise. 

The “Technology Overview Series: CompoNet,” published in the Document Library, gives a comprehensive overview to CompoNet.