Technical Paper Abstract
The Special Interest Group for xDS Digital Device Descriptions is working to develop a specification for ODVA’s next generation of device description, as a robust, extensible, and secure artifact. This paper will describe the current state of the art in the development of xDS. The paper will include details about the use of AutomationML constructs to describe components, the use of Open Packaging Conventions to package the various components, security approaches, and proposed tools to ease the adoption of xDS.
As the specification for xDS is developed, some of the details provided in this paper may change, but it will provide a general overview of the current direction of the xDS SIG.
Paper and presentation from the 2022 ODVA Industry Conference & 21st Annual Meeting
Matthew Frazer, ODVA
Todd Snide, Schneider Electric