Significant changes are being made to the physical layer (Chapter 8) in both DeviceNet™ and EtherNet/IP™ volumes. For DeviceNet, the changes are more clarification and design factors for both cable drop lengths. For EtherNet/IP, the changes are more technology changes for higher data rate of 1G in an industrial environment and harmonizing with IEC standards. Creating a technical guideline document for earthing (grounding) and bonding for all ODVA physical layers to use.
Paper and presentation from the 2014 ODVA Industry Conference & 16th Annual Meeting
Brad Woodman, Molex