Technical Paper Abstract
Recent initiatives within ODVA have facilitated the means by which a Process application can be realized. Enhancements to the technology have allowed the development of solutions to address use-cases such as device interoperability, connectivity into hazardous environments, the presentation of diagnostic information aligned to user specifications and the integration of legacy technologies. This paper will provide an overview of which scenarios can now be met whilst highlighting areas where further development is needed in order to facilitate the further adoption of the CIP technologies in process applications.
Paper and presentation from the 2022 ODVA Industry Conference & 21st Annual Meeting
Vivek Hajarnavis, Rockwell Automation
Dawn Kelsch, Micro Motion
Rizwan Mohammed, Honeywell
Michaël Voegel, Endress + Hauser Digital Solutions