ODVA Proceedings

Search and download select technical papers and presentations from ODVA's Library of Proceedings from Industry Conferences & Annual Meetings. Use the Category Filter checkboxes to select a year and/or track; or find articles by presenter name, workshop title, or topic keyword using the Search Library field. 

Technical papers and presentations from individual sessions at the 2017 Industry Conference and 18th Annual Meeting have been posted.  A single zip file download of 2017 ODVA Industry Conference Technical Papers is also available.

Articles for '2017'

Technical Track, 2017
Updated on: February 28, 2017 14:57
2017 ODVA Industry Conference Technical Papers (zip file)

The final versions of all ODVA technical papers from The 2017 Industry Conference & 18th Annual Meeting of Members are available in this download.

General Sessions, 2017
Updated on: March 01, 2017 17:19
Building a Technology Strategy for the Industrial IOT World

Edy Liongosari, Chief Research Scientist and Managing Director, Accenture Labs

Presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Description
In 2015 the World Economic Forum (WEF), in collaboration with Accenture, published a landmark report “The Industrial Internet of Things: Unleashing the Potential of Connected Products and Services.” Although the Industrial IoT is not in the general business press as much as its consumer counterpart, industry accounts for more than half of the world economy making Industrial IOT one of the major transformational business opportunities of the 21st century. In this session, Edy Liongosari, one of co-authors of the WEF report, will share findings from the report, and his views, on how OT automation suppliers can build a successful technology strategy for the Industrial IOT world.

Technical Track, 2017
Updated on: February 28, 2017 14:34
CIP Safety - Concepts for Dynamic Transfer of Parametric Data

Kevin Colloton, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
A functional gap in CIP Safety is being able to change parametric data in a safety I/O class device (or get data from a safety device) on-demand (when the need arises) based on safety program execution. Today, parametric data can only be sent when the device CIP Safety connection is opened, or by embedding parametric data as part of a safety output data assembly. Sending parametric data in the Forward_Open configuration block is not suitable for program driven parametric data exchange with a safety device. In fact, for a safety device, the configuration block of the Safety Open is part of the Safety Signature and cannot be modified programmatically without violating the devices safety signature. Using the Output Assembly for on-demand parameter data transfer is both wasteful and a misuse of I/O connection’s intent, not to mention that the number and complexity of the resulting assembly structures would explode.

With no effective mechanism for on-demand programmatic data exchange, CIP Safety systems limit the flexibility customers have for advanced safety applications, especially for motion safety related functions, and looking forward for high availability (SIS) safety systems.

Technical Track, 2017
Updated on: February 28, 2017 12:14
CIP Security - Implementation Considerations

Ron Floyd, Pyramid Solutions

Michael Mann, Pyramid Solutions

Jack Visoky, Rockwell Automation

Joakim Wiberg, HMS Industrial Networks


Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
CIP Security (Profile 1) adds transport layer security to the CIP protocol, and has a large, system-wide impact on CIP based products. As such, there are many considerations that product developers must take into account when designing CIP Security enabled products. Many of these issues can have potential security implications and as a result require careful thought. Although the ODVA CIP Security specification provides sufficient information for the implementation of this protocol, it is still beneficial to product developers to have some additional guidance at their disposal. The aim of this paper is to provide non-normative guidance around many of the important considerations that have an impact on CIP Security implementations. This paper does not seek to replace or replicate the information within the CIP Security specification, but rather provides additional guidance and information. Furthermore, as this paper is non-normative, the information described within is not necessary for compliance (unless it is also stated within the official CIP Security specification).

Keywords
CIP Security, Cyber Security, Certificates, Authentication, Integrity, TLS

Technical Track, 2017
Updated on: February 28, 2017 14:29
Common Industrial Cloud Interface – Uses Cases and Technical Requirements for Data Transfer

Stephen C. Briant, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
The Industrial Internet of Things (IIoT) is here, bringing new technologies, challenges and opportunities to industrial automation. Companies are looking to the internet and cloud computing to provide new ways to improve operations, increasing productivity and generate more revenue. Acquiring data from devices is a primary focus of IIoT in the market today, but there are definitely opportunities to do more. What are the challenges presented by these relatively new applications? What technologies are being leveraged to solve these challenges? What capabilities are needed to allow CIP Devices to provide an advantage in these applications? This paper will cover various applications or use cases and discuss the challenges presented by these applications. Several open communication protocols in use today will be examined as possible solutions to these challenges. Opportunities to leverage or extend existing standards, including ODVA standards, will be discussed. 

Keywords
Device, Cloud, Gateway, Interfaces, Messaging, Storage, Analytics, Streaming, Big Data, IIoT

Marketing Track, 2017
Updated on: February 28, 2017 16:56
Developer's Workshop: Session A - Introduction to the Know-How Hub and the Developer's ToolBox for EtherNet/IP

ODVA Staff

Presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

ODVA’s Know-How Hub on www.odva.org provides a wealth of information for developers who are building products to ODVA technologies. This session delivered a step-by-step introduction to all areas of the Know-How Hub in order to provide a better understanding of how ODVA’s online resources can aid your product development. This session included an introduction to the Developer's ToolBox for EtherNet/IP, a digital learning environment to study and experiment EtherNet/IP development within one's own personal computing environment. 

Marketing Track, 2017
Updated on: March 15, 2016 17:17
Developer's Workshop: Session B - Network Conformance Testing 2017

ODVA Staff 

Presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Description
This session will detail the latest enhancements to the conformance test suite and will outline the rules of the conformance testing process. Attend this session to learn how to avoid development mistakes that can delay timely product launch and to gain a solid understanding of the steps you can take for a conformance test that runs quickly and successfully.

Marketing Track, 2017
Updated on: March 01, 2017 16:55
Developer's Workshop: Session C - CIP Safety™ Conformance Testing 2017

ODVA Staff

Presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Intended for current or prospective developers of CIP Safety products, this session presented the latest developments in CIP Safety Conformance Testing, plus techniques you can use to prepare for a lab test that runs smoothly. A clear understanding of these responsibilities before and during product development can avoid costly, product-delaying problems and rework. 

Technical Track, 2017
Updated on: February 28, 2017 14:31
DeviceNet of Things - Use Cases, Value Proposition and Status of Specification

John Caspers, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
This paper introduces the key technical concepts associated with the specification enhancements proposed for Volume 3 (DevicNet) of the CIP Specification related to “DeviceNet of Things” SIG work. It includes discussions around the following topics:

  • How DeviceNet will be enhanced as an in-panel cabling and communication system solution. Connection methods and ease of use will be improved without posing business or compatibility risk to those already applying DeviceNet.
  • An overview of the new “DeviceNet or Things” specification enhancement set that builds on the existing DeviceNet specification, including:
  1. The proposed in-cabinet cabling and connector solution.
  2. Support for the discovery and presentation of the physical topology of network nodes based on their relative geographical position on the network.
  3. How network geographical information will be provided to remote clients when a DeviceNet of Things network is implemented as a subnet to other CIP networks such as EtherNet/IP.
  4. How simplified network commissioning will be performed by remote client tools and/or CIP Routers
  5. How the system will facilitate the development of low cost communication interfaces for devices with extremely cost sensitive bills of materials.
  6. How the system will support the automatic replacement of defective nodes with compatible nodes of the same type during full system operation, and how “geographic device keying” will help facilitate this.
  7. How a new “Power Tap” architecture will allow commercial off the shelf power supplies to be used in DeviceNet of Things systems.
  8. How “Smart Taps” and “Smart Terminators” will provide improved network diagnostic capabilities in a DeviceNet of Things system.
  9. How “Smart Drops” can be developed to allow existing DeviceNet nodes to work in a DeviceNet of Things system.
  • How the DeviceNet of Things will help pave the way for future adoption of EtherNet/IP as Ethernet costs continue to decline.

Keywords
DoT - DeviceNet of Things, Smart Tap, Smart Terminator, Smart Drop, Nodal Geography, Actual Nodal Geography, Reference Geography, Network Power, Select Line, Select Line Protocol, Group 5 Messaging, IDC - Insulation Displacement Connector, Device Commissioning, Network Commissioning

Technical Track, 2017
Updated on: February 28, 2017 14:37
E2E Links - New ISO/IEC Channel Definitions

Bob Lounsbury, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
As Ethernet expands so does the methods of measuring the cabling system performance. Industrial customers tend to install cables and then terminate in-place. The quality of the field termination is dependent on many factors including wire end preparation. The cables and connectors used in the channel may meet or exceed the component specifications, but if improperly terminated the link or channel may not. The cabling industry channel definitions and tests do not include the plugs (or connections) at the two ends of the channel. This means that, if the ends of the cables are improperly prepared the channel will pass but the performance may be less than satisfactory. The international standards committees for industrial have been working to define a new definition called End to End Links (E2E Links). These links not only include the connections between the two ends but also include the end connections. This paper will discuss these new links and how they will help your customers and field service personnel diagnose cable problems and verify cabling in the field. 

Keywords
Physical Layers, Ethernet, IEC, ISO/IEC, TIA, E2E Links, MICE, Automation Island 

Technical Track, 2017
Updated on: February 24, 2017 16:58
EtherNet/IP to the Edge – A Concept for "Low-complexity Ethernet”

David Alsup, Innovasic

Tom Weingartner, Innovasic 

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
Simple field devices, such as sensors and actuators, have long resisted incorporating Ethernet as a fieldbus interface. The reasons for this reluctance are plenty, but from a device integration viewpoint, the limiting factors have been the size, power, and cost of the Ethernet interface itself. Many advancements in communication technology have taken place over the past few years that have changed the landscape for Ethernet to address these limitations. This paper defines the concept of “Low-complexity Ethernet” and describes how this concept can be used to bring reliable EtherNet/IP communication to edge devices like sensors and actuators. The paper will also identify future directions that could enable brownfield installations to take advantage of bringing EtherNet/IP to the edge.

Keywords
EtherNet/IP, Industrial Ethernet, Ethernet Interface, Fieldbus, Field Device, Sensors, Actuators, Edge Devices, IIoT

 

General Sessions, 2017
Updated on: March 01, 2017 18:35
General Session and 18th Term in Review (2017)

Katherine Voss, President and Executive Director, ODVA

Joakim Wiberg, Chief Technology Officer, ODVA 

Presentation from 2017 Industry Conference & 18th Annual Meeting of Members

Technical Track, 2017
Updated on: February 28, 2017 13:23
High Availability - Guidelines for Use of DLR in EtherNet/IP Networks

Jordon Woods, Innovasic

Whitepaper (Pub 316) and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Guidelines for Using Device Level Ring (DLR) with EtherNet/IP (Pub 316)

Introduction
Ethernet is growing in popularity across all levels of enterprise including industrial processes and applications. There are a variety of Industrial applications in which Ethernet ring topologies are preferable to the star topologies common in enterprise networks. Ring networks provide inherent single-point fault tolerance. Ring nodes that include embedded switch technology reduce the need for infrastructure switches and simplify network cabling. Device Level Ring (DLR) protocol provides a means for detecting, managing and recovering from faults in a ring-based network.

Implementation of DLR imposes certain requirements upon the supporting network infrastructure. DLR does not inherently exclude the use of devices which do not support the DLR protocol in a DLR-enabled network. It is expected that legacy devices and other considerations will frequently dictate the use of such devices in a DLR network. However, the use of these devices in a DLR network may significantly affect DLR operation and performance. This whitepaper is intended to provide an overview of DLR and to provide guidelines for implementing a DLR network comprised of DLR devices and devices which do not support the DLR protocol.

Technical Track, 2017
Updated on: February 28, 2017 12:41
IEEE 802.3cg (10SPE) – 10 Mb/s Single Pair Ethernet Meeting Industrial Automation Objectives

David Brandt, Rockwell Automation

Dayin Xu, Rockwell Automation

Jörg Hähniche, Endress+Hauser

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
Since the turn of the century, Industrial Automation has seen an ever increasing adoption of Ethernet-based networking and the associated IP stack. One vision is that of a single network paradigm from the Cloud to the field devices – yielding many lifecycle benefits. Industrial Ethernet can bridge IT and OT, being appropriate for MES, most controllers and user interfaces, and many field applications. However, a number of practical concerns limit the utilization of Ethernet at the field edge. In particular, the 100 m distance limitation and the high implementation cost relative to the smallest components have held back complete Ethernet adoption. In addition, special environment requirements such as intrinsic safety have held back some markets, in particular Process Automation. Currently, a variety of non-Ethernet solutions, typically buses or point to point links, augment Ethernet for a complete solution. Issues with such a mixed system include the additional complexity of application gateways and proxies, obtaining specialized skill in many networking technologies, and the lack of IP-related protocol convergence for IIoT and related usage. Demand and feasibility are shown for long distance by Process Automation industry fair demonstrations, and for low cost by continued Automotive push for innovative cost reduction techniques beyond the established single pair architecture. In July 2016, the IEEE 802.3 authorized the “10 Mb/s Single Twisted Pair Ethernet Study Group” (informally known as “10SPE”), kicking off the development of a set of Ethernet enhancements aimed at closing these gaps. This paper discusses this IEEE activity and the potential benefits to the Industrial Automation markets.

Keywords
Ethernet, IEEE 802.3, IEEE 802.3cg, 10SPE, Single-pair, Industrial Automation, Process Automation, In-cabinet, Fieldbus, IEC 60079, Intrinsic Safety, NAMUR, ODVA, EtherNet/IP

Technical Track, 2017
Updated on: February 28, 2017 13:10
IT and OT Convergence - Recommendations for Building an IoT-Ready Manufacturing Network

Arun Siddeswaran, Cisco Systems

Gregory Wilcox, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
Manufacturing networks are evolving towards a converged architecture with integrated IT and OT systems. Connecting devices and assets in a converged architecture enables data acquisition, remote monitoring and cloud based predictive analytics. This leads to lower costs, higher productivity, and greater visibility into plant operations. However the converged network design must ensure that security and performance requirements are not compromised as a result. This session will provide an overview of various use cases, best practices and architecture recommendations in the areas of resiliency, wireless, defense-in-depth security as well as cloud connectivity and integration.

Keywords
IT OT Convergence, best practices, architecture, manufacturing, design, industrial 

General Sessions, 2017
Updated on: March 01, 2017 16:57
Lessons Learned - A Day in the Life of Field Device Users

Sven Seintsch, Chairman of NAMUR Working Group 2.6 Fieldbus, Bilfinger Maintenance GmbH

Presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
In 2016 NAMUR, an international user association for automation technology in the process industries, published a position paper "An Ethernet Communication System for the Process Industry." Although Ethernet is yet to be widely deployed in the process industry, the convergence of IT with OT is expected to drive a paradigm shift in process automation to Ethernet-connected field devices. In this session, Sven Seintsch, one of the co-authors of the NAMUR position paper, will share lessons learned from users in the process industry on how field devices can make or break operating effectiveness and his perspective on how IT technologies such as Ethernet and NAMUR's Open Architecture may transform the future of the process industry.

Marketing Track, 2017
Updated on: March 01, 2017 15:29
Marketeers Workshop: Promotional Opportunities in the 19th Term

ODVA Staff 

Presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Description
Learn from ODVA staff about plans for the next term to promote ODVA technologies and how you can utilize the benefits of your membership to promote your products incorporating ODVA technologies.

Technical Track, 2017
Updated on: February 28, 2017 13:39
PoE, PoE++, PoDL - Enhancements to IEEE 802.3

Bob Lounsbury, Rockwell Automation

Brad Woodman, Molex

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
The IOT is exploding with far reaching applications such as Automotive, Home Automation, Building Automation, and Machine to Machine. Ethernet has become the universal communications network helping to drive this technology.

This paper will look at the current status of the cabling standards such as IEC/SC65C/JWG10, ISO/IECJTC1/SC25/WG3 and ANSI TIA/TR42. In addition, this paper will focus on the status of IEEE 802.3 adaptions of standard Ethernet and the opportunities that it presents to ODVA. IEEE 802.3 committees recently published a higher level PoE (PoE++) and Power over Data link (PoDL). These new powered enhancements can provide an attractive solution for powering a range of small devices up to larger IO devices. PoE++ is attractive for Industrial as it potentially can deliver some 90+ watts to the Powered Device (PD). Even more exciting are the number of newly proposed high speed single pair Ethernet adaptions being defined. These new adaptions will simplify the wiring and reduce space needed for the cabling in industrial installations.

The national and international cabling standards are already actively engaged with IEEE 802.3 working groups helping to define the cabling requirements for these new emerging networks. This paper will discuss the new industrial channel definitions (E2E Links) being defined by ISO/IEC that promise to help our customers successfully install and test their cabling.

Keywords
Physical Layers, Ethernet, IEC, ISO/IEC, TIA, PoE, PoE++, PoDL, E2E Links, MICE, Automation Island

Technical Track, 2017
Updated on: February 24, 2017 16:22
QoS - Application of TSN to EtherNet/IP Networks

Jordon Woods, Innovasic 

Steve Zuponcic, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
Deterministic Ethernet is already widely used in industrial control systems. Many Industrial protocols solve the problem of determinism over Ethernet using proprietary layer 2 solutions. The new IEEE 802.1 TSN standards are aimed at the same class of problems encountered in industrial control and promise to supplant proprietary solutions in favor of a standards-based approach. EtherNet/IP has always relied upon standard, commercially available Ethernet technologies to deliver deterministic performance and is therefore well-positioned to leverage these emerging standards.

In this paper we discuss specific use cases and examine how the emerging TSN standards can be applied to EtherNet/IP networks to provide improved determinism and performance. We will also contrast the results expected in a TSN-based network with those of the technologies currently in use.

Keywords
Industrial Ethernet, Industrial Control, Motion Control, EtherNet/IP, CIP Motion, CIP Sync, Time-Sensitive Networking, Audio-Video Bridging, AVB, AVB Gen2, software-defined networking, SDN, deterministic Ethernet.

Technical Track, 2017
Updated on: February 28, 2017 13:13
Resource-constrained Industrial Things - Proposal for the Adaptation of CoAP to EtherNet/IP

Jonas Green, HMS Industrial Networks

Björn Otterdahl, HMS Industrial

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
The idea of the Internet of Things to act and sense in the physical world have opened up for new innovations within the communication technology area. A resource constrained device such as a sensor can hardly handle the complexity of a transport protocol like TCP to produce a simple sensing value when it also must consider limited resources in terms of computation power and energy. There are multiple communication protocols under development targeting Internet of Things devices that have achieved reliable communication with minimal resource usage both on the device and on the network. Inspired by previous work in extending EtherNet/IP™ to resource-constrained industrial things this paper investigates the Constrained Application Protocol (CoAP) and the possibility to adapt it to the CIP™ protocol. CoAP is a transport protocol built upon the IP and the UDP protocol designed for use with constrained devices and constrained networks. Previous work put the responsibility to handle the lost reliability on the application when replacing the TCP protocol with UDP. Investigations shows that this is not necessary. For resource constrained devices, handling small amounts of data, CoAP together with UDP replaces the TCP protocol with only a 4-byte fixed header and a compact encoding of options for additional information without compromising the reliability of the network. CoAP supports confirmable and non-confirmable messages, has a basic set of methods to interact with resources of a device and identifies resources by using Uniform Resource Identifiers (URIs). This design conforms well to the CIP protocol which requires handling of explicit messaging and IO connections, possibility to address objects and attributes of the CIP object model and services to interact with those. CoAP together with single pair Ethernet would create a good communication solution for resource constrained industrial things. With the coming transition to IPv6 there will also be several wireless physical layers suitable for resource constrained devices such as the Bluetooth wireless technology, 6LoWPAN and the ZigBee Standard. With a device level network using IP addressing the CIP networks could over time converge towards one common addressing mechanism. To take advantage of the features of CoAP, IP addressing on the device level network and multiple physical layers for constrained devices this paper presents a proposal of how CoAP can be adapted to CIP to handle explicit messaging and IO connections to resource constrained industrial things of a CIP network.

Keywords
CoAP, IPv6, DTLS, Industrial Internet of Things 

 

General Sessions, 2017
Updated on: March 01, 2017 18:10
The Future of Industrial Automation: Looking Ahead to ODVA’s 19th Term

Katherine Voss, President and Executive Director, ODVA

Presentation from the 2017 Industry Conference and 18th Annual Meeting of Members

Technical Track, 2017
Updated on: February 24, 2017 16:43
TSN – Influences on ODVA Technologies: IEEE-802.1, Avnu, IETF

Paul Didier, Cisco Systems

Mark Hantel, Rockwell Automation

Rudy Klecka, Cisco Systems

Steve Zuponcic, Rockwell Automation

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
Time Sensitive Networks standards are being considered for adoption by ODVA into EtherNet/IP. This paper will provide a status and update to the ODVA community on the underlying TSN groundwork being done by other standards groups, and the potential impacts of this work on EtherNet/IP.

  1. Review the current TSN standards status in IEEE,
  2. Review the work in IETF DETNET to create wide-area deterministic networks 
  3. Review the work of Avnu developing interoperability and certification standards for TSN, including the Theory of Operations for TSN, a systems design document. 
  4. Review current ODVA SIG activities in response to new TSN technologies.

The paper will review the standard status and content that make up IEEE 802.1 TSN, especially: 

  • IEEE 802.1Qcc Stream Reservation Protocol (SRP) Enhancements and Performance Improvements;
  • IEEE 802.1Qbv Enhancements for Scheduled Traffic;
  • IEEE 802.1Qbu Frame Preemption;
  • Precision Time (IEEE1588 and IEEE802.1AS)

This paper provides a summary for the following TSN standards:

  • IEEE 802.1Qci Per-stream filtering and policing;
  • IEEE 802.1CB Frame Replication and Elimination for Reliability;
  • IEEE 802.1Qca Path Control and Reservation;

Finally, this paper discusses how EtherNet/IP and TSN standards might combine to provide a new generation of “standard, unmodified, Ethernet” with features and capabilities not previously achievable.

Keywords
ODVA, EtherNet/IP, CIP, TSN, Time Sensitive Networks, SDN, Software Defined Networking, IEEE 802.1, 802.1, Scheduled Ethernet, Industrial Ethernet, CNC, Centralized Network Configuration, CUC, Centralized User Configuration, Network Calculus

Technical Track, 2017
Updated on: February 28, 2017 13:46
TSN - Report on the IIC Testbed

Paul Didier, Cisco Systems

George Ditzel, Cisco Systems

Ludwig Leurs, Bosch Rexroth

Jordon Woods, Innovasic

Paper and presentation from the 2017 Industry Conference & 18th Annual Meeting of Members 

Technical Paper Abstract
This paper will give a report from the Industrial Internet Consortium’s TSN Manufacturing testbed. The goal of this testbed is to display the value of new Ethernet (IEEE 802) standards referred to as Time Sensitive Networks in a manufacturing ecosystem of applications. Four ODVA Members are participating in the testbed, including Bosch Rexroth, Cisco, Innovasic and Schneider Electric. The testbed will: 

  • Combine different critical (e.g. OPC Pub/Sub and ODVA CIP) and best-effort traffic flows on a single network based on IEEE 802.1 Time Sensitive Networking (TSN) 
  • Demonstrate the real-time capability and vendor interoperability using standard, converged Ethernet 
  • Evaluate security value of TSN and provide feedback on the secure-ability of initial TSN functions 
  • Show ability for IIoT to incorporate high performance and latency sensitive applications  
  • Provide integration points for smart edge-cloud control systems into IIoT infrastructure & application 

By the time of the report, the testbed will have conducted at least 2 plugfests where a variety of vendors have demonstrated varying levels of integration with TSN-based networking technology. This paper will report on the applications used, the level of integration and readiness of TSN based standard technology and report some of the value of TSN to the ODVA community.

Keywords
Industrial Ethernet, Industrial Control, Industrial Internet Consortium, IIC, Motion Control, EtherNet/IP, Time-Sensitive Networking, TSN, software-defined networking, SDN, deterministic Ethernet.